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Solar Thin Film Photovoltaics
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Patent US10259206
Issued 2019-04-16
Epitaxial Lift Off Systems And Methods
Epitaxial lift off systems and methods are presented. In one embodiment a tape is disposed on the opposite side of the epitaxial material than the substrate is used to hold the epitaxial material during the etching and removal steps of the ELO process. In various embodiments, the apparatus for removing the ELO film from the substrates without damaging the ELO film may include an etchant reservoir, substrate handling and tape handling mechanisms, including mechanisms to manipulate (e.g., cause tension, peel, widen the etch gap, etc.) the lift off component during the lift off process.
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- 1. A system comprising:
an etchant application component configured to apply etchant to a sacrificial layer disposed between an epitaxial lift off component and a growth substrate of a plurality of growth substrates processed by the system, wherein the etchant application component comprises a substrate handling belt having a plurality of substrate pockets each of which is configured to receive one of the growth substrates and hold the etchant within, along with the respective growth substrate, wherein the etchant application component further comprises an etchant supply component configured to deliver the etchant to each growth substrate and the respective substrate pocket to fill the substrate pocket with the etchant, and wherein at least a portion of a surface of each substrate pocket contacts the growth substrate therein; a separation assistance component configured to manipulate the epitaxial lift off component to assist separation of the epitaxial lift off component from the growth substrate, wherein manipulation of the epitaxial lift off component is controlled to facilitate exposure of an etchant to an etch face of the sacrificial etch layer; and a tape application component configured to couple the epitaxial lift off component to a tape, wherein the tape assists the manipulation and transportation of the epitaxial lift off component while etchant is applied to the sacrificial layer.
- 13. An epitaxial lift off system comprising:
a wafer receiving stage wherein each wafer processed by the system includes a substrate, a sacrificial etch layer, an epitaxial lift off component, wherein each substrate is supported by a substrate pocket of a plurality of substrate pockets in a substrate handling belt, wherein each substrate pocket is configured to receive the substrate and hold etchant within, along with the respective growth substrate, and an etchant supply component configured to deliver the etchant to the substrate and the respective substrate pocket to fill the substrate pocket with the etchant, and wherein at least a portion of a surface of the substrate pocket contacts the substrate therein; a tape coupling application stage, wherein the epitaxial lift off component of each wafer is coupled to a tape; and an etching stage wherein the lift off component is manipulated to assist etchant exposure to an etch face of the sacrificial etch layer and aid separation of the epitaxial lift off component from the substrate.
