Application US20180019359 Solar Thin Film Photovoltaics

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Application US20180019359

Published 2018-01-18

Multi-junction Optoelectronic Device

An optoelectronic semiconductor device is disclosed. The device comprises a plurality of stacked p-n junctions (e.g., multi junction device). The optoelectronic semiconductor device includes a n-doped layer disposed below the p-doped layer to form a p-n layer such that electric energy is created when photons are absorbed by the p-n layer. Recesses are formed on top of the p-doped layer at the top of the plurality of stacked p-n junctions. The junctions create an offset and an interface layer is formed on top of the p-doped layer at the top of the plurality stacked p-n junctions. The device also includes a window layer disposed below the plurality stacked p-n junctions. In another aspect, one or more optical filters are inserted into a device to enhance its efficiency through photon recycling. The device can be fabricated by epitaxial growth on a substrate and removed from the substrate through a lift off process.

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1 Independent Claim

1. A method for fabricating a device, comprising: epitaxially growing the device on a substrate, the device having a first side and a second side closer to the substrate, the device being configured to receive light at the second side of the device, and the epitaxially growing of the device including: epitaxially growing a plurality of stacked p-n layers between the first side and the second side of the device, each of the plurality of stacked p-n layers comprising a p-doped layer and an n-doped layer, with a p-n junction formed between the p-doped layer and the n-doped layer such that at least one of the plurality of stacked p-n layers generates electrical energy when photons are absorbed by that p-n layer in response to the device being exposed to a light source on the second side of the device, and each p-n layer having a first side and a second side, and the first side of each p-n layer being closer than its second side to the first side of the device; and removing the device from the substrate using a lift off process.