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Solar Thin Film Photovoltaics
Search All Applications in Solar Thin Film Photovoltaics
Application US20180033894
Published 2018-02-01
Metal-foil-assisted Fabrication Of Thin-silicon Solar Cell
One embodiment relates to a method of fabricating a solar cell. A silicon lamina is cleaved from the silicon substrate. The backside of the silicon lamina includes the P-type and N-type doped regions. A metal foil is attached to the backside of the silicon lamina. The metal foil may be used advantageously as a built-in carrier for handling the silicon lamina during processing of a frontside of the silicon lamina. Another embodiment relates to a solar cell that includes a silicon lamina having P-type and N-type doped regions on the backside. A metal foil is adhered to the backside of the lamina, and there are contacts formed between the metal foil and the doped regions. Other embodiments, aspects and features are also disclosed.
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- 1. A solar cell comprising:
a substrate having a front side that is configured to face the sun during normal operation and a backside opposite the front side; an encapsulant on the front side of the substrate; a transparent layer on the encapsulant; a P-type emitter and an N-type emitter on the backside of the substrate; a first dielectric on the P-type emitter and the N-type emitter; a metal foil having a first contact that is electrically connected to the P-type emitter through the first dielectric and a second contact that is electrically connected to the N-type emitter through the first dielectric; and an adhesive layer that the adheres the metal foil to the first dielectric.
- 9. A solar cell comprising:
a silicon lamina; P-type and N-type doped regions on a backside of the silicon lamina; a metal foil adhered to the backside of the silicon lamina; a first set of contacts between the metal foil and the P-type doped regions; and a second set of contacts between the metal foil and the N-type doped regions.
- 17. A solar cell comprising:
a primary substrate having a front side that faces the sun during normal operation and a backside opposite the front side; a P-type emitter and an N-type emitter on the backside of the primary substrate; a first dielectric layer on the P-type and N-type emitters; a metal foil on the dielectric layer, the metal foil having a first contact finger that is electrically connected to the P-type emitter through the dielectric layer and a second contact finger that is electrically connected to the N-type emitter through the dielectric layer; and a secondary substrate on the metal foil, wherein the metal foil includes a finger separation area between the first dielectric layer and the secondary substrate.
