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Application US20200116930
Published 2020-04-16
Photonics Packaging Method And Device
Photonic packages are described. One such photonic package includes a photonic chip, an application specific integrated circuit, and optionally, an interposer. The photonic chip includes photonic microelectromechanical system (MEMS) devices. A photonic package may include a material layer patterned to include recesses. The recesses are aligned with the photonic MEMS devices so as to form enclosed cavities around the photonic MEMS devices. This arrangement preserves the integrity of the photonic MEMS devices.
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- 1. A photonic package comprising:
a photonic chip having a surface, a first recess formed on the surface, and a photonic microelectromechanical system (MEMS) device positioned at least partially in the first recess; a substrate mounted on the surface of the photonic chip; and a material layer disposed between the substrate and the photonic chip, the material layer having a second recess, the second recess being aligned with the first recess.
- 18. A photonic package comprising:
a photonic chip having a plurality of photonic microelectromechanical system (MEMS) modulators; and an application specific integrated circuit (ASIC) disposed on the photonic chip, the ASIC being in electrical communication with the plurality of photonic MEMS modulators.
- 25. A method for fabricating a photonic package, the method comprising:
obtaining a photonic chip having a plurality of photonic microelectromechanical system (MEMS) devices; patterning a non-conductive film to form a plurality of recesses; applying the patterned non-conductive film to a substrate; and mounting the substrate to the photonic chip such that the plurality of recesses are aligned with respective ones of the plurality of photonic MEMS devices.
